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NanoMaterials Facility
 Automatic Dicing Saw
CNS ID: SW-1
MakeDisco
ModelDAD-321
CategoryBack-End and Characterization
NameAutomatic Dicing Saw
LocationLISE - G06
 
 
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More Info
Equipment description and usage:

DISCO ADA-321 dicing saw uses a rotating ultra-thin diamond impregnated blade, in a wet environment, to cut materials such as silicon wafers, III-V semiconductors, glass sheets, ceramic, etc. into almost any shapes with straight edges. Cutting process is controlled automatically through software recipe programming. The machine is also capable of accurate, multi-directional on-screen semiautomatic alignment.

Applications:

Cut semiconductor and ceramic materials into almost any shapes with straight edges.

Features:

* Maximum workpiece size: 6”
* Maximum cutting depth: 3 mm
* Position accuracy: < 3 um (accumulated in 5 continues cuts)
* Cutting-depth repeating accuracy: ~ 1 um
* Cutting speed: 0.1 – 300 mm/s
* Maximum spindle speed: 50,000 rpm
* Minimum step size: ~ 0.2 um
Comments
Semiconductors, Ceramics
 
Contact Info:
Jason Tresback
LISE G46
11 Oxford Street
Cambridge, MA 02138
617-496-1783
jtresbackcns.fas.harvard.edu
Jiangdong Deng
LISE G54
11 Oxford Street
Cambridge, MA 02138
617-495-3396
jdengcns.fas.harvard.edu
 
 

07/23/13
New DRIE on-line and available for Training !!

 

05/02/13
LED Measurement System and Integrating Sphere now available! Contact Jason Tresback for training.

 

03/12/13
Quantox non-contact electrical measurement tool commissioned. See Philippe for training.

 

02/20/13
Olympus Total Internal Reflection Fluorescence Microscopy Hands-On Demo

 

DRIE system on site - available soon.

 

01/18/13
i-line stepper coming to CNS this spring!

 

08/14/12
We bought the k-alpha XPS - it will be staying!

 

05/14/12
We bought the Heidelberg uPG501 direct write system - it will be staying!

 

10/04/12
XeF2 etch system now available!

 

02/21/12
Time Resolved PL Spectroscopy now available