Material Synthesis Facility |
| Automatic Dicing Saw |
| CNS ID: SW-1 |
| Make: Disco |
| Model: DAD-321 |
| Category: Back-End and Characterization |
| Name: Automatic Dicing Saw |
| Location: LISE - G06 |
| |
| |
|
| Click on a thumbnail to enlarge. For multiple images: after a picture has enlarged, you can move between photos by clicking on the right/left edges of the enlarged image. |
 |
|
More Info:
Equipment description and usage:
DISCO ADA-321 dicing saw uses a rotating ultra-thin diamond impregnated blade, in a wet environment, to cut materials such as silicon wafers, III-V semiconductors, glass sheets, ceramic, etc. into almost any shapes with straight edges. Cutting process is controlled automatically through software recipe programming. The machine is also capable of accurate, multi-directional on-screen semiautomatic alignment.
Applications:
Cut semiconductor and ceramic materials into almost any shapes with straight edges.
Features:
* Maximum workpiece size: 6”
* Maximum cutting depth: 3 mm
* Position accuracy: < 3 um (accumulated in 5 continues cuts)
* Cutting-depth repeating accuracy: ~ 1 um
* Cutting speed: 0.1 – 300 mm/s
* Maximum spindle speed: 50,000 rpm
* Minimum step size: ~ 0.2 um |
Comments:
Semiconductors, Ceramics |
| |
| Contact Info: |
Jason Tresback
LISE G46
11 Oxford Street
Cambridge, MA 02138
617-496-1783
jtresback cns.fas.harvard.edu |
Jiangdong Deng
LISE G54
11 Oxford Street
Cambridge, MA 02138
617-495-3396
jdengcns.fas.harvard.edu |
|
|
|
| |
|
| |
