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Nanofabrication Facility
 Wire Bonder
CNS ID: WB-1
Make: West Bond
Model: N/A
Category: Back-End and Characterization
Name: Wire Bonder
Location: LISE - G12
 
 
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More Info: 
Wedge bonder configured for aluminum wire (.001�). It will attach to pads down to 100 microns square in a feature density of 150 microns (pad to pad) The system is tuned for bonding the wire to Au but will work on Al ,Cu with a tip change and some parameter adjustment.
Comments: 
 
Contact Info:
Steve Paolini
LISE G50
11 Oxford Street
Cambridge, MA 02138
617-496-9816
spaolinicns.fas.harvard.edu
Jiangdong Deng
LISE G54
11 Oxford Street
Cambridge, MA 02138
617-495-3396
jdengcns.fas.harvard.edu
 
 

05/06/13
New Computational Cluster On-Line
 

05/02/13
LED Measurement System and Integrating Sphere now available! Contact Jason Tresback for training.
 

03/12/13
Quantox non-contact electrical measurement tool commissioned. See Philippe for training.
 

02/20/13
Olympus Total Internal Reflection Fluorescence Microscopy Hands-On Demo
 

DRIE system on site - available soon.
 

01/18/13
i-line stepper coming to CNS this spring!
 

08/14/12
We bought the k-alpha XPS - it will be staying!
 

05/14/12
We bought the Heidelberg uPG501 direct write system - it will be staying!
 

10/04/12
XeF2 etch system now available!
 

02/21/12
Time Resolved PL Spectroscopy now available
 
 
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