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Nanofabrication Facility
 Nexx RIE
CNS ID: RIE-6
MakeNexx Systems
ModelCirrus 150
CategoryDry Process
NameNexx RIE
LocationLISE - Cleanroom G07
 
 
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More Info
Equipment description and usage:
NEXX RIE-6 is an ECR (electron cyclotron resonance) reactive plasma etch system. ECR produces high plasma density and low ion energy at low chamber pressure, resulting in high etch rate, good etching uniformity and low ion damage. The system is integrated with a load-lock wafer transporter, allowing fast system pumping-down and low base pressure (10-6) to 10-7 Torr). Backside helium fluid-cooled chuck allows substrate temperature to be controlled in -15 to +80 C range. The entire system is computer controlled.

Applications:
Reactive ion etch of semiconductor and other dielectric, metals and polymers thin films.

Features:
* ECR high-density plasma system
* Fully integrated load lock with automatic wafer-pallet transport system
* Substrate cooling and heating * Available gases: CF4, CHF3, Cl2, Ar, O2, H2, CH4, He
* Turbomolecular pump, backed by an oil-free mechanic pump, base pressure down in the 10-6 to 10-8 Torr range
* Etching uniformity: 10% across 2" substrate * Wafer size: 4" to 6"
Comments
Loadlock, heat/cool
 
Contact Info:
Ling Xie
LISE G52
11 Oxford Street
Cambridge, MA 02138
617-496-9069
lxiecns.fas.harvard.edu
John Tsakirgis
LISE G52
11 Oxford Street
Cambridge, MA 02138
617-384-9651
jtsakirgcns.fas.harvard.edu
 
 

07/23/13
New DRIE on-line and available for Training !!

 

05/02/13
LED Measurement System and Integrating Sphere now available! Contact Jason Tresback for training.

 

03/12/13
Quantox non-contact electrical measurement tool commissioned. See Philippe for training.

 

02/20/13
Olympus Total Internal Reflection Fluorescence Microscopy Hands-On Demo

 

DRIE system on site - available soon.

 

01/18/13
i-line stepper coming to CNS this spring!

 

08/14/12
We bought the k-alpha XPS - it will be staying!

 

05/14/12
We bought the Heidelberg uPG501 direct write system - it will be staying!

 

10/04/12
XeF2 etch system now available!

 

02/21/12
Time Resolved PL Spectroscopy now available