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Nanofabrication Facility
 SPTS Rapier DRIE
CNS ID: RIE-10
MakeSPTS Technologies
ModelOmega LPX Rapier
CategoryDry Process
NameSPTS Rapier DRIE
LocationLISE - Cleanroom G07
 
 
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More Info
The SPTS’s Rapier system etches Si using Bosch switched processing for vertical profiles as well as non-switched processing for tapered profiles. The system is equipped with dual plasma sources with independently controlled primary and secondary decoupled plasma zones, with independent dual gas inlets; which results in high etch rate, good uniformity, and less tilting around wafer edge. The Electro-Static Clamping Chuck enables good wafer clamping, less wafer bowing compared with mechanical clamping, and wafer-less chamber cleaning. The attached AMS chiller can control the chuck temperature from -20°C to + 40°C and the Claritas end point detector can minimize the micro-trenches of SOI wafer etch as well as control the pre-etch and the post-etch cleaning.
Comments
Application • Si etch solely • High aspect ratio etch: 5 – 50 • Deep etch: 5µm – through Si wafer etch • Broad features: from nano- to mm- scales in lateral dimension • Sider wall roughness (scallop depth): 6nm – 700nm • Only resists and SiO2 or Si3N4 allowed as etching mask • Handle samples ≤ 6” • Absolutely no-metal mask or metal stop layer
 
Contact Info:
Ling Xie
LISE G52
11 Oxford Street
Cambridge, MA 02138
617-496-9069
lxiecns.fas.harvard.edu
Steve Paolini
LISE G50
11 Oxford Street
Cambridge, MA 02138
617-496-9816
spaolinicns.fas.harvard.edu
 
 

07/23/13
New DRIE on-line and available for Training !!

 

05/02/13
LED Measurement System and Integrating Sphere now available! Contact Jason Tresback for training.

 

03/12/13
Quantox non-contact electrical measurement tool commissioned. See Philippe for training.

 

02/20/13
Olympus Total Internal Reflection Fluorescence Microscopy Hands-On Demo

 

DRIE system on site - available soon.

 

01/18/13
i-line stepper coming to CNS this spring!

 

08/14/12
We bought the k-alpha XPS - it will be staying!

 

05/14/12
We bought the Heidelberg uPG501 direct write system - it will be staying!

 

10/04/12
XeF2 etch system now available!

 

02/21/12
Time Resolved PL Spectroscopy now available