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NanoMaterials Facility
 AB-M Mask Aligner
CNS ID: OL-2
MakeAB-M
ModelN/A
CategorySoft Materials Cleanroom
NameAB-M Mask Aligner
LocationLISE - Soft Materials Cleanroom G07
 
 
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More Info
contact Ilke Akartuna
akartuna@seas.harvard.edu
for training information
Comments
This mask alignment and exposure system has a table-top configuration and offers Mid UV and Deep UV (248nm with filter change) exposure capabilities. It is a contact aligner with precision x, y, z and substrate rotation controls. It has a single-field high magnification zoom microscope for alignment. We provide three circular vacuum chucks for 2", 3" and 4" wafers, as well as a rectangular chuck for small samples, with Wedge Compensation (Planarizing) feature. The aligner has two mask holders for 4"x4" and 5"x5" sized masks, ideal for 3" and 4" wafers respectively. The minimum feature size that can be achieved on this system is about 2 micrometers. (However the practical limit will ultimately depend on the mask resolution, the photoresist type, thickness and uniformity, and the level of contact between the photoresist layer and the mask.)
 
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07/23/13
New DRIE on-line and available for Training !!

 

05/02/13
LED Measurement System and Integrating Sphere now available! Contact Jason Tresback for training.

 

03/12/13
Quantox non-contact electrical measurement tool commissioned. See Philippe for training.

 

02/20/13
Olympus Total Internal Reflection Fluorescence Microscopy Hands-On Demo

 

DRIE system on site - available soon.

 

01/18/13
i-line stepper coming to CNS this spring!

 

08/14/12
We bought the k-alpha XPS - it will be staying!

 

05/14/12
We bought the Heidelberg uPG501 direct write system - it will be staying!

 

10/04/12
XeF2 etch system now available!

 

02/21/12
Time Resolved PL Spectroscopy now available