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Nanofabrication Facility
 Finetech Flip Chip Bonder
CNS ID: FCB-1
MakeFinetech
ModelFineplacer
CategoryBack-End and Characterization
NameFinetech Flip Chip Bonder
LocationLISE - G12
 
 
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More Info
Fineplacer Lambda Manual Sub-Micron Flip-Chip Bonder provides accurate alignment and placement of a device chip to a substrate as an advanced form of chip interconnection. During the bonding process, both chip and substrate are typically heated to an alloying temperature of the interconnect material. Also available is a heated pick and place tool which allows for heating the device chip in a full thermocompression bonding process.
Comments
 
Contact Info:
Guixiong Zhong
LISE G42
11 Oxford Street
Cambridge, MA 02138
617-384-5672
gzhongcns.fas.harvard.edu
Steve Paolini
LISE G50
11 Oxford Street
Cambridge, MA 02138
617-496-9816
spaolinicns.fas.harvard.edu
Jiangdong Deng
LISE G54
11 Oxford Street
Cambridge, MA 02138
617-495-3396
jdengcns.fas.harvard.edu
 
 

07/23/13
New DRIE on-line and available for Training !!

 

05/02/13
LED Measurement System and Integrating Sphere now available! Contact Jason Tresback for training.

 

03/12/13
Quantox non-contact electrical measurement tool commissioned. See Philippe for training.

 

02/20/13
Olympus Total Internal Reflection Fluorescence Microscopy Hands-On Demo

 

DRIE system on site - available soon.

 

01/18/13
i-line stepper coming to CNS this spring!

 

08/14/12
We bought the k-alpha XPS - it will be staying!

 

05/14/12
We bought the Heidelberg uPG501 direct write system - it will be staying!

 

10/04/12
XeF2 etch system now available!

 

02/21/12
Time Resolved PL Spectroscopy now available