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More Info:
Fineplacer Lambda Manual Sub-Micron Flip-Chip Bonder provides accurate alignment and placement of a device chip to a substrate as an advanced form of chip interconnection. During the bonding process, both chip and substrate are typically heated to an alloying temperature of the interconnect material. Also available is a heated pick and place tool which allows for heating the device chip in a full thermocompression bonding process.
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Contact Info:
Steve Paolini
LISE G50
11 Oxford Street
Cambridge, MA 02138
617-496-9816
spaolinicns.fas.harvard.edu
Jiangdong Deng
LISE G54
11 Oxford Street
Cambridge, MA 02138
617-495-3396
jdengcns.fas.harvard.edu
cns.fas.harvard.edu
